Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/71501
Title: Anti-heat transfer labels
Authors: Chan, De Sheng
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2017
Abstract: Study of the properties of 2 kinds of holographic materials. The 2 materials were tested for expansions and shrinkage when put under heat stress, and cuts were made in order to test for the changes in widths of the cuts after degrees of heat.
URI: http://hdl.handle.net/10356/71501
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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