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|Title:||Scaled up Ni electroforming process for defect-free metal filling in micro trench pattern and high deposition rate||Authors:||Sim, Nicholas Wei Qiang||Keywords:||DRNTU::Engineering::Materials::Nanostructured materials||Issue Date:||2017||Abstract:||The effects of PEG & electric potential on the electroforming rate of nickel are investigated to provide for an optimum setup that can be used to support the goals of this project. The goals of this project are to ensure a bottom-up deposition of Nickel on the substrate samples as well as an improved rate of deposition of about 20 μm/Hr is achieved at the end of this project. Furthermore, a larger setup will be used in this project consisting of an electroforming bath of 2.3 Litres that will be agitated in a rotational motion. Experiments will be carried out with adjustments in the PEG concentration of the electroforming bath and the electric potential used for the experiments. Each experiment will be carefully recorded using the VersaStudio software. Samples will be cut using a diamond cutter to reveal the desired cross-section, and microscopy is then used to observe the cross-sectional deposition morphology.||URI:||http://hdl.handle.net/10356/71685||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Student Reports (FYP/IA/PA/PI)|
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|SCALED UP NI ELECTROFORMING PROCESS FOR DEFECT-FREE METAL FILLING IN MICRO TRENCH PATTERN AND HIGH DEPOSITION RATE.pdf|
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