Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/71685
Title: Scaled up Ni electroforming process for defect-free metal filling in micro trench pattern and high deposition rate
Authors: Sim, Nicholas Wei Qiang
Keywords: DRNTU::Engineering::Materials::Nanostructured materials
Issue Date: 2017
Abstract: The effects of PEG & electric potential on the electroforming rate of nickel are investigated to provide for an optimum setup that can be used to support the goals of this project. The goals of this project are to ensure a bottom-up deposition of Nickel on the substrate samples as well as an improved rate of deposition of about 20 μm/Hr is achieved at the end of this project. Furthermore, a larger setup will be used in this project consisting of an electroforming bath of 2.3 Litres that will be agitated in a rotational motion. Experiments will be carried out with adjustments in the PEG concentration of the electroforming bath and the electric potential used for the experiments. Each experiment will be carefully recorded using the VersaStudio software. Samples will be cut using a diamond cutter to reveal the desired cross-section, and microscopy is then used to observe the cross-sectional deposition morphology.
URI: http://hdl.handle.net/10356/71685
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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