Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/73105
Title: Mitigation of noise propagation on power and ground layers with electromagnetic band-gap (EBG) structure
Authors: Yao, Shu
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2018
Abstract: In this dissertation, several cases are investigated to explore methods of mitigation of the noise propagation within the metal layers of a printed circuit board (PCB) using an Electromagnetic Band-Gap (EBG) structure. The Computer Simulation Technology (CST) Microwave Studio simulation software is used to design, construct, simulate and analyze different configurations of the EBG structure on the PCB. All the simulations are performed in the frequency-domain and the analysis is based on the Sparameter results obtained from the simulation. These different configurations are compared with each other through the analysis of the S-parameter results, in terms of their capability and performance of the noise suppression. These results can be applied to the fabrication of PCBs for the fulfillment of high-speed power integrity performance. Finally, several recommendations are made to further improve the study of the implementation of the EBG structure.
URI: http://hdl.handle.net/10356/73105
Schools: School of Electrical and Electronic Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
YAO SHU_2017.pdf
  Restricted Access
4.18 MBAdobe PDFView/Open

Page view(s)

333
Updated on Mar 21, 2025

Download(s)

6
Updated on Mar 21, 2025

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.