Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/75773
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dc.contributor.authorEkaputra, Vinsens
dc.date.accessioned2018-06-14T04:23:51Z
dc.date.available2018-06-14T04:23:51Z
dc.date.issued2018
dc.identifier.urihttp://hdl.handle.net/10356/75773
dc.description.abstractOne of the most discussed technology now days is augmented reality and its application. However, the research in this topic has actually started decades ago. In 1997, Azuma et al. has published a survey discussing augmented reality and its potential. However, only with the recently commercialized augmented reality hardware like Microsoft HoloLens and Epson Moverio; together with the advancement of computer vision algorithm, SLAM system, and deep learning, now developers have accessed to the tools that can create a working augmented reality application. In this project, an augmented reality application dealing with the manual assembly process will be made. Using Unity as the mainframe and Wikitude to handle the object detection and 3D models' augmentation, the application will guide the user step by step in assembling a Lego structure from its pieces, replacing the traditional way of using the instruction book. The application itself will be made for Android devices which includes the common smart phone/tablet and an augmented reality glasses called Epson Moverio.en_US
dc.format.extent36 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineering::Assistive technologyen_US
dc.subjectDRNTU::Engineering::Mechanical engineering::Mechatronicsen_US
dc.subjectDRNTU::Engineering::Mechanical engineering::Prototypingen_US
dc.titleAugmented reality application for assembly trainingen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorTegoeh Tjahjowidodoen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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