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Title: Mechanical characterizations of high temperature polymer encapsulation
Authors: Chan, Wei Hao
Keywords: DRNTU::Engineering::Materials
Issue Date: 2018
Abstract: The development of a new high temperature polymer is the key to achieving high reliability operations in aerospace and well-logging applications as conventional encapsulation materials such as epoxy, polyimide or silicone do not suffice in high pressure high temperature (HPHT) environment. In this study, a new type of heterocyclic polymer was developed and synthesized. The effects of the alumina and silica fillers on the moisture absorption, tensile strength and thermal properties of this new heterocyclic polymer were investigated. Composite samples were fabricated with different proportions of fillers in this new heterocyclic polymer matrix. The moisture absorption test was carried out under constant condition of two different conditions, 70oC/85% Relative Humidity (RH) and 80oC/85% RH. Results indicated that a significant reduction of moisture uptake with both the micro size filler particles, alumina and silica. In addition, the moisture uptake also decreased with increasing filler loading. The melting enthalpy and temperature were analysed using the Differential Scanning Calorimetry (DSC). It was found that the melting temperature and melting enthalpy increased with increasing filler loading. The instron test results showed that the addition of filler increased the tensile strength. Static stress analysis with solidworks simulation revealed that dome shaped design could reduce the overall stress experienced by the electronic package, in particular the silicon die. Overall, results of all these analyses indicated that both the alumina and silica filler particles were able to enhance the properties of this new type of heterocyclic polymer.
Schools: School of Materials Science and Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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