Thermal heat spread modelling using COMSOL

Abstract

Heat transfer and dissipation using Phase Change Materials (PCMs) is a relatively new form of technology that could potentially revolutionise cooling systems of future industries. At the present moment, construction of new buildings have incorporated PCMs into their walls or roofs structure to provide additional cooling of the building. Studies have shown that the regenerative properties of PCM which is to absorb heat when temperature increases and release heat when temperature decreases helps to reduce overall energy usage cost especially during daytime use. This is very beneficial for commercial buildings which makes use of the Air Conditioning and Mechanical Ventilation (ACMV) system for improved indoor cooling and comfort as the reduced temperature fluctuations means a potentially lesser cost of maintenance for the ACMV system.

For the past three years, scientists are exploring ways to implement PCMs as an alternative and stable heat sink for electronic devices as compared to traditional methods like cooling fans or more advanced technology like liquid cooling systems found in gaming laptops. However, pure PCMs are known to have low thermal conductivity therefore this report aims to provide a study of how honeycomb cell structure made of an impurity helps to increase the overall thermal conductivity. Different cell sizes will also be tested to determine the effect towards the overall thermal conductivity of the PCM.