Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/77871
Title: Anti-heat transfer label
Authors: Thian, Hui Ning
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2019
Abstract: For the past decades, shape memory polymers have been developed extensively and become more significant in the industry today. It is a smart material that encompasses the ability to return from a deformed state to its original state with the help of a trigger. The trigger could be heat, light, magnetic field, chemical and electricity. In this report, heat triggered shape memory polymer would be tested and discussed. The purpose of this study is to create an anti-heat transfer label that can be incorporated in the current void label, to act as a failsafe layer should heat is used to tamper the label.
URI: http://hdl.handle.net/10356/77871
Schools: School of Mechanical and Aerospace Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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