Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/78451
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dc.contributor.authorChua, Claudia Jiayi
dc.date.accessioned2019-06-20T04:18:04Z
dc.date.available2019-06-20T04:18:04Z
dc.date.issued2019
dc.identifier.urihttp://hdl.handle.net/10356/78451
dc.description.abstractDifferent from the embedded systems we see today, Cyber Physical System is an integration of physical systems, communication systems and computing systems. Communication is of high importance in the CPS. To achieve smooth integration, the events in the physical world must mirror the events in the cyber world. Then the feedback from the cyber world must be communicated accurately to the physical world. As a result, it is crucial to study the networks that constitutes to the CPS. Firstly, a study on the communication network and wireless sensor networks is conducted. Understanding the constraints that CPS pose – diversity of components communication networks and limited capacity of components – an optimised network topology will be discussed. Efficient transmission of data is also important for a communication network due to time constraints of the component. Thus, routing design of the network as well as algorithms (i.e. greedy algorithm) implemented are discussed. Security aspects of CPS are crucial as well. Therefore, discussion on designing a resilient network against attacks (i.e. Denial-of-Service) is done. Lastly, some limitations are raised for further research in the future.en_US
dc.format.extent41 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleOnline network topology optimization and hybrid routing protocol design of a cyber-physical systemen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorWen Changyunen_US
dc.contributor.supervisorDeng Chao
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineering (Electrical and Electronic Engineering)en_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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