Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/78600
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dc.contributor.authorAng, Mun Ru
dc.date.accessioned2019-06-24T05:53:56Z
dc.date.available2019-06-24T05:53:56Z
dc.date.issued2019
dc.identifier.urihttp://hdl.handle.net/10356/78600
dc.description.abstractThe advancement in technology has led to the rise of a form of non-contact three-dimensional optical metrology system known as Phase Measuring Deflectometer (PMD). The ability of the system to perform a non-destructive measurement of high accuracy and high speed at a lower cost in contrast to the traditional system has resulted in an increasing demand for such a product. This report presents the evaluation of 3 types of existing PMD system in the laboratory with the aim of developing the existing PMD system into a commercialised product. These 3 systems are a Stereoscopic PMD system and 2 single cameras vertical PMD system of medium and small size. This evaluation stems from the understanding of the PMD principle and operation of the existing PMD system derived from the testing and experimental process. Mirror lens was tested in place of a wafer as a result of the need to understand the characteristics of the mirror lens as well as the ability of the system in measuring those characteristics. This evaluation served as the basis for the development of the design of a commercialised PMD system. All design presented in this report can be categorized into 2 forms, namely the development of the design to improve on the existing system as well as the development of an entirely new design. A simplified version of the prototype is then created after the evaluation of the developed design based on cost and how critical is a particular component to the design overall function. All design developed in this project will not be able to be fully pursued at this stage due to the cost constraint. Thus, a recommendation on the development or the creation of the developed design is presented towards the end of the report.en_US
dc.format.extent72 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleFlatness and warpage measurement of semiconductor wafersen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorAnand Krishna Asundien_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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