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Title: Power and area efficient clock stretching and critical path reshaping for error resilience
Authors: Jayakrishnan, Mini
Chang, Alan
Kim, Tony Tae-Hyoung
Keywords: Better Than Worst Case Design
Error Tolerance
DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2019
Source: Jayakrishnan, M., Chang, A., & Kim, T. T.-H. (2019). Power and area efficient clock stretching and critical path reshaping for error resilience. Journal of Low Power Electronics and Applications, 9(1), 5-. doi:10.3390/jlpea9010005
Series/Report no.: Journal of Low Power Electronics and Applications
Abstract: Energy efficient semiconductor chips are in high demand to cater the needs of today’s smart products. Advanced technology nodes insert high design margins to deal with rising variations at the cost of power, area and performance. Existing run time resilience techniques are not cost effective due to the additional circuits involved. In this paper, we propose a design time resilience technique using a clock stretched flip-flop to redistribute the available slack in the processor pipeline to the critical paths. We use the opportunistic slack to redesign the critical fan in logic using logic reshaping, better than worst case sigma corner libraries and multi-bit flip-flops to achieve power and area savings. Experimental results prove that we can tune the logic and the library to get significant power and area savings of 69% and 15% in the execute pipeline stage of the processor compared to the traditional worst-case design. Whereas, existing run time resilience hardware results in 36% and 2% power and area overhead respectively.
ISSN: 2079-9268
DOI: 10.3390/jlpea9010005
Schools: School of Electrical and Electronic Engineering 
Organisations: VIRTUS, IC Design Centre of Excellence
Rights: © 2019 The Authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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