Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/79637
Title: Fast analysis of a large-scale inductive interconnect by block-structure-preserved macromodeling
Authors: Tan, Sheldon X. D.
Yu, Hao
Chu, Chunta Lei He
Shi, Yiyu
Smart, David
He, Lei
Issue Date: 2009
Source: Yu, H., Chu, C. L. H., Shi, Y., Smart, D., He, L., & Tan, S. X. D. (2009). Fast analysis of a large-scale inductive interconnect by block-structure-preserved macromodeling. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 18(10), 1399-1411.
Series/Report no.: IEEE transactions on very large scale integration (VLSI) systems
Abstract: To efficiently analyze the large-scale interconnect dominant circuits with inductive couplings (mutual inductances), this paper introduces a new state matrix, called VNA, to stamp inverse-inductance elements by replacing inductive-branch current with flux. The state matrix under VNA is diagonal-dominant, sparse, and passive. To further explore the sparsity and hierarchy at the block level, a new matrix-stretching method is introduced to reorder coupled fluxes into a decoupled state matrix with a bordered block diagonal (BBD) structure. A corresponding block-structure-preserved model-order reduction, called BVOR, is developed to preserve the sparsity and hierarchy of the BBD matrix at the block level. This enables us to efficiently build and simulate the macromodel within a SPICE-like circuit simulator. Experiments show that our method achieves up to 7× faster modeling building time, up to 33× faster simulation time, and as much as 67× smaller waveform error compared to SAPOR [a second-order reduction based on nodal analysis (NA)] and PACT (a first-order 2×2 structured reduction based on modified NA).
URI: https://hdl.handle.net/10356/79637
http://hdl.handle.net/10220/8562
ISSN: 1063-8210
DOI: 10.1109/TVLSI.2009.2024343
Rights: © 2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [http://dx.doi.org/10.1109/TVLSI.2009.2024343].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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