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Title: Modeling and layout optimization of differential inductors for Silicon-based RFIC applications
Authors: Sia, Choon Beng
Ong, Beng Hwee
Lim, Wei Meng
Yeo, Kiat Seng
Alam, Tariq
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2008
Source: Sia, C. B., Ong, B. H., Lim, W. M., Yeo, K. S., & Alam, T. (2008). Modeling and layout optimization of differential inductors for Silicon-based RFIC applications. IEEE Transactions on Electron Devices, 55(4), 1058-1066.
Series/Report no.: IEEE transactions on electron devices
Abstract: A scalable RF differential inductor model has been developed, enabling device performance versus layout size tradeoffs and optimization as well as accurate circuit predictions. Comparing inductors with identical inductance values up to an operating frequency of 10 GHz, large conductor width designs are found to yield good performance for inductors with small inductance values. As differential inductance or operating frequency increases, interactions between metallization resistive and substrate losses discourage the use of large widths as it consumes silicon area and degrades device performance.
ISSN: 0018-9383
DOI: 10.1109/TED.2008.917536
Rights: © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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