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Title: Carbon nanotube bumps for the flip chip packaging system
Authors: Yap, Chin Chong
Brun, Christophe
Tan, Dunlin
Li, Hong
Teo, Edwin Hang Tong
Baillargeat, Dominique
Tay, Beng Kang
Issue Date: 2012
Source: Yap, C. C., Brun, C., Tan, D., Li, H., Teo, E. H. T., Baillargeat, D., et al. (2012). Carbon nanotube bumps for the flip chip packaging system. Nanoscale Research Letters, 7(1), 105.
Series/Report no.: Nanoscale research letters
Abstract: Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained.
ISSN: 1556-276X
DOI: 10.1186/1556-276X-7-105
Rights: © 2012 The Authors.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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