Please use this identifier to cite or link to this item:
Title: Industrial attachment report on quality and reliability of Pb-free solder joint
Authors: Marsellus Yohz Hendryanto
Keywords: DRNTU::Engineering::Materials
Issue Date: 2002
Abstract: This report presented four sub-projects done for the respective QRA aspects for Pb-free solder joint. They are comparison of the common Sn/Pb and Pb-free solder paste; inter-metallic study of common Sn/Pb and Pb-free Solder Paste' Pb-free Module Relia
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
  Restricted Access
9.12 MBAdobe PDFView/Open

Page view(s) 50

Updated on Nov 25, 2020

Download(s) 50

Updated on Nov 25, 2020

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.