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https://hdl.handle.net/10356/8035| Title: | Industrial attachment report on quality and reliability of Pb-free solder joint | Authors: | Marsellus Yohz Hendryanto | Keywords: | DRNTU::Engineering::Materials | Issue Date: | 2002 | Abstract: | This report presented four sub-projects done for the respective QRA aspects for Pb-free solder joint. They are comparison of the common Sn/Pb and Pb-free solder paste; inter-metallic study of common Sn/Pb and Pb-free Solder Paste' Pb-free Module Relia | URI: | http://hdl.handle.net/10356/8035 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Student Reports (FYP/IA/PA/PI) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MPE-REPORTS_16.pdf Restricted Access | 9.12 MB | Adobe PDF | View/Open |
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