Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/8035
Title: Industrial attachment report on quality and reliability of Pb-free solder joint
Authors: Marsellus Yohz Hendryanto
Keywords: DRNTU::Engineering::Materials
Issue Date: 2002
Abstract: This report presented four sub-projects done for the respective QRA aspects for Pb-free solder joint. They are comparison of the common Sn/Pb and Pb-free solder paste; inter-metallic study of common Sn/Pb and Pb-free Solder Paste' Pb-free Module Relia
URI: http://hdl.handle.net/10356/8035
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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