Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/8040
Title: Industrial attachment report with Micron Semiconductor Asia Pte Ltd
Authors: Airin Alamsjah
Keywords: DRNTU::Engineering::Materials
Issue Date: 2003
Abstract: Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out.
URI: http://hdl.handle.net/10356/8040
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
MPE-REPORTS_20.pdf
  Restricted Access
2.5 MBAdobe PDFView/Open

Page view(s) 20

470
Updated on Oct 24, 2021

Download(s) 50

40
Updated on Oct 24, 2021

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.