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Title: Industrial attachment report with Micron Semiconductor Asia Pte Ltd
Authors: Airin Alamsjah
Keywords: DRNTU::Engineering::Materials
Issue Date: 2003
Abstract: Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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