Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/8048
Title: Report on industrial attachment with Cookson Semiconductor Packaging Materials
Authors: Koo, Yeng Ping.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).
URI: http://hdl.handle.net/10356/8048
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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