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Title: Report on industrial attachment with Cookson Semiconductor Packaging Materials
Authors: Koo, Yeng Ping.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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