Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/8050
Title: Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
Authors: Ng, Yew Hong.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2000
Abstract: This report investigated substrate performance of different design and material for microelectronics packaging.
URI: http://hdl.handle.net/10356/8050
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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