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https://hdl.handle.net/10356/8050| Title: | Report on industrial attachment with Micron Semiconductor Asia Pte Ltd | Authors: | Ng, Yew Hong. | Keywords: | DRNTU::Engineering::Materials | Issue Date: | 2000 | Abstract: | This report investigated substrate performance of different design and material for microelectronics packaging. | URI: | http://hdl.handle.net/10356/8050 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Student Reports (FYP/IA/PA/PI) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MPE-REPORTS_3.pdf Restricted Access | 11.08 MB | Adobe PDF | View/Open |
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