Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/80593
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dc.contributor.authorPing, Jianfengen
dc.contributor.authorGao, Fengen
dc.contributor.authorChen, Jian Linen
dc.contributor.authorWebster, Richard Daviden
dc.contributor.authorSteele, Terry W. J.en
dc.date.accessioned2017-03-16T05:27:24Zen
dc.date.accessioned2019-12-06T13:52:52Z-
dc.date.available2017-03-16T05:27:24Zen
dc.date.available2019-12-06T13:52:52Z-
dc.date.issued2015en
dc.identifier.citationPing, J., Gao, F., Chen, J. L., Webster, R. D., & Steele, T. W. J. (2015). Adhesive curing through low-voltage activation. Nature Communications, 6, 8050-.en
dc.identifier.issn2041-1723en
dc.identifier.urihttps://hdl.handle.net/10356/80593-
dc.identifier.urihttp://hdl.handle.net/10220/42177en
dc.description.abstractInstant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development of an instant curing adhesive through low-voltage activation. The electrocuring adhesive is synthesized by grafting carbene precursors on polyamidoamine dendrimers and dissolving in aqueous solvents to form viscous gels. The electrocuring adhesives are activated at −2 V versus Ag/AgCl, allowing tunable crosslinking within the dendrimer matrix and on both electrode surfaces. As the applied voltage discontinued, crosslinking immediately terminated. Thus, crosslinking initiation and propagation are observed to be voltage and time dependent, enabling tuning of both material properties and adhesive strength. The electrocuring adhesive has immediate implications in manufacturing and development of implantable bioadhesives.en
dc.description.sponsorshipMOE (Min. of Education, S’pore)en
dc.format.extent9 p.en
dc.language.isoenen
dc.relation.ispartofseriesNature Communicationsen
dc.rights© 2015 Macmillan Publishers Ltd. This paper was published in Nature Communications and is made available as an electronic reprint (preprint) with permission of Macmillan Publishers Ltd. The published version is available at: [http://dx.doi.org/10.1038/ncomms9050]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en
dc.subjectAdhesive agenten
dc.subjectDendrimeren
dc.titleAdhesive curing through low-voltage activationen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Materials Science and Engineeringen
dc.contributor.schoolSchool of Physical and Mathematical Sciencesen
dc.identifier.doi10.1038/ncomms9050en
dc.description.versionPublished versionen
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