Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/8059
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dc.contributor.authorSeah, Suan Hee.en_US
dc.date.accessioned2008-09-19T01:55:46Z-
dc.date.available2008-09-19T01:55:46Z-
dc.date.copyright1999en_US
dc.date.issued1999-
dc.identifier.urihttp://hdl.handle.net/10356/8059-
dc.description.abstractThe report is divided into three parts: the company profile, the projects undertaken by the author were introduced and discussed (include Design and Build Manual Burn-in Tester, Set Limits for Burn-in and VSCEL Die and Improving of Low Yield Problem at TOen_US
dc.format.extent140 p.-
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials-
dc.titleReport on industrial attachment with Hewlett-Packard Singaporeen_US
dc.typeIndustrial Attachment (IA)en_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
item.fulltextWith Fulltext-
item.grantfulltextrestricted-
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)
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