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https://hdl.handle.net/10356/80981
Title: | Graphene phonon softening and splitting by directional straining | Authors: | Yang, X. X. Wang, Y. Li, J. W. Liao, W. H. Liu, Y. H. Sun, Chang Qing |
Keywords: | Phonons Graphene Strain measurement Chemical bonds Diamond |
Issue Date: | 2015 | Source: | Yang, X. X., Wang, Y., Li, J. W., Liao, W. H., Liu, Y. H., & Sun, C. Q. (2015). Graphene phonon softening and splitting by directional straining. Applied Physics Letters, 107, 203105-. | Series/Report no.: | Applied Physics Letters | Abstract: | Strain-induced graphenephonon softening and phonon band splitting are indeed fascinating, which were attributed to the phonon double resonant scattering without intrinsic involvement of C-C bond relaxation. Here, we show that the lengthening and weakening of the C-C bond softens the phonon and that the mismatching between the uniaxial strain and the C3vbond geometry splits the band. In addition to the force constant of 11.8 N/m for a C-C bond in graphene, consistency between theory and measurements derives that if the strain is along a bond, maximal band splitting happens; if the strain is perpendicular, no band splitting occurs. | URI: | https://hdl.handle.net/10356/80981 http://hdl.handle.net/10220/39016 |
ISSN: | 0003-6951 | DOI: | 10.1063/1.4935604 | Schools: | School of Electrical and Electronic Engineering | Rights: | © 2015 AIP Publishing LLC. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of AIP Publishing LLC.. The published version is available at: [http://dx.doi.org/10.1063/1.4935604]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles |
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