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dc.contributor.authorZhang, Boweien
dc.contributor.authorWu, Junshengen
dc.contributor.authorPeng, Dongdongen
dc.contributor.authorLi, Xiaogangen
dc.contributor.authorHuang, Yizhongen
dc.identifier.citationZhang, B., Wu, J., Peng, D., Li, X., & Huang, Y. (2016). In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper. International Journal of Electrochemical Science, 11, 4110-4119.en
dc.description.abstractIn-situ scanning vibrating electrode technique (SVET) combined with other techniques (such as electrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3-amino-1, 2, 4-triazole (ATA) and sodium molybdate (SM) as a corrosion inhibitor for copper in 3.5% NaCl solution in comparison with benzotriazole (BTA). The results indicate that copper shows extremely higher corrosion resistance in 3.5% NaCl solution with the presence of ATA-SM inhibitor than BTA. This is due to the reaction of ATA with copper allowing the formation of a thin film incorporated with MoO4 ion precipitates on the surface of copper, which provides strong cathodic efficiency and thus is considerably protective.en
dc.description.sponsorshipMOE (Min. of Education, S’pore)en
dc.format.extent10 p.en
dc.relation.ispartofseriesInternational Journal of Electrochemical Scienceen
dc.rights© 2016 The Authors. Published by ESG ( This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (
dc.titleIn-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copperen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.description.versionPublished versionen
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