Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81530
Title: Epitaxial growth of low threading dislocation density InSb on GaAs using self-assembled periodic interfacial misfit dislocations
Authors: Jia, Bo Wen
Tan, Kian Hua
Loke, Wan Khai
Wicaksono, Satrio
Yoon, Soon Fatt
Keywords: Epitaxial Growth
TEM
Issue Date: 2015
Source: Jia, W. B., Tan, K. H., Loke, W. K., Wicaksono, S., & Yoon, S. F. (2015). Epitaxial growth of low threading dislocation density InSb on GaAs using self-assembled periodic interfacial misfit dislocations. Materials Letters, 158, 258-261.
Series/Report no.: Materials Letters
Abstract: We report a fully relaxed low threading dislocation density InSb layer grown on a GaAs substrate using self-assembled periodic interfacial misfit dislocations. The InSb layer was grown at 310°C by molecular beam epitaxy. The AFM measurement exhibited a root mean square (r.m.s.) roughness of 1.1 nm. ω-2θ scan results from x-ray diffraction measurement indicated that the InSb layer is 98.9% relaxed. Images from the transmission electron microscope measurement showed a threading dislocation density of 1.38×108 cm-2. The formation of highly uniform interfacial misfit dislocation array was also observed and the separation of dislocations is consistent with theoretical calculation. The InSb layer exhibited a 33,840 cm2/V s room temperature electron mobility.
URI: https://hdl.handle.net/10356/81530
http://hdl.handle.net/10220/39576
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2015.05.123
Schools: School of Electrical and Electronic Engineering 
Rights: © 2015 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Materials Letters, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.matlet.2015.05.123].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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