Please use this identifier to cite or link to this item:
Title: Effect of cold-work on the Hall–Petch breakdown in copper based micro-components
Authors: Ghassemali, Ehsan
Tan, Ming-Jen
Wah, Chua Beng
Lim, S.C.V.
Jarfors, Anders E.W.
Keywords: Microforming
Size effect
Dislocation cells
Issue Date: 2014
Source: Ghassemali, E., Tan, M.-J., Wah, C. B., Lim, S., & Jarfors, A. E. (2015). Effect of cold-work on the Hall–Petch breakdown in copper based micro-components. Mechanics of Materials, 80124-135.
Series/Report no.: Mechanics of Materials
Abstract: Effects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties.
ISSN: 0167-6636
DOI: 10.1016/j.mechmat.2014.10.003
Schools: School of Mechanical and Aerospace Engineering 
Organisations: A*STAR SIMTech
Rights: © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Mechanics of Materials, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles
SIMTech Journal Articles

Files in This Item:
File Description SizeFormat 
Effect of cold-work on the Hall–Petch breakdown in copper based micro-components.pdf5.15 MBAdobe PDFThumbnail

Citations 20

Updated on Jun 15, 2024

Web of ScienceTM
Citations 20

Updated on Oct 25, 2023

Page view(s) 50

Updated on Jun 15, 2024

Download(s) 10

Updated on Jun 15, 2024

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.