Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81567
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dc.contributor.authorGhassemali, Ehsanen
dc.contributor.authorTan, Ming-Jenen
dc.contributor.authorWah, Chua Bengen
dc.contributor.authorLim, S.C.V.en
dc.contributor.authorJarfors, Anders E.W.en
dc.date.accessioned2016-01-06T07:04:07Zen
dc.date.accessioned2019-12-06T14:33:54Z-
dc.date.available2016-01-06T07:04:07Zen
dc.date.available2019-12-06T14:33:54Z-
dc.date.issued2014en
dc.identifier.citationGhassemali, E., Tan, M.-J., Wah, C. B., Lim, S., & Jarfors, A. E. (2015). Effect of cold-work on the Hall–Petch breakdown in copper based micro-components. Mechanics of Materials, 80124-135.en
dc.identifier.issn0167-6636en
dc.identifier.urihttps://hdl.handle.net/10356/81567-
dc.identifier.urihttp://hdl.handle.net/10220/39595en
dc.description.abstractEffects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties.en
dc.description.sponsorshipASTAR (Agency for Sci., Tech. and Research, S’pore)en
dc.format.extent32 p.en
dc.language.isoenen
dc.relation.ispartofseriesMechanics of Materialsen
dc.rights© 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Mechanics of Materials, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.mechmat.2014.10.003].en
dc.subjectMicroformingen
dc.subjectSubgrainen
dc.subjectMicrostructureen
dc.subjectSize effecten
dc.subjectDislocation cellsen
dc.titleEffect of cold-work on the Hall–Petch breakdown in copper based micro-componentsen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen
dc.contributor.organizationA*STAR SIMTechen
dc.identifier.doi10.1016/j.mechmat.2014.10.003en
dc.description.versionAccepted versionen
item.fulltextWith Fulltext-
item.grantfulltextopen-
Appears in Collections:MAE Journal Articles
SIMTech Journal Articles
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