Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81567
Title: Effect of cold-work on the Hall–Petch breakdown in copper based micro-components
Authors: Ghassemali, Ehsan
Tan, Ming-Jen
Wah, Chua Beng
Lim, S.C.V.
Jarfors, Anders E.W.
Keywords: Microforming
Subgrain
Microstructure
Size effect
Dislocation cells
Issue Date: 2014
Source: Ghassemali, E., Tan, M.-J., Wah, C. B., Lim, S., & Jarfors, A. E. (2015). Effect of cold-work on the Hall–Petch breakdown in copper based micro-components. Mechanics of Materials, 80124-135.
Series/Report no.: Mechanics of Materials
Abstract: Effects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties.
URI: https://hdl.handle.net/10356/81567
http://hdl.handle.net/10220/39595
ISSN: 0167-6636
DOI: 10.1016/j.mechmat.2014.10.003
Rights: © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Mechanics of Materials, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.mechmat.2014.10.003].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles
SIMTech Journal Articles

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