Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81601
Title: Surface roughness effect on copper–alumina adhesion
Authors: Lim, Ju Dy
Yeow, Su Yi Susan
Rhee, MinWoo Daniel
Leong, Kam Chew
Wong, Chee Cheong
Keywords: Surface area
Surface roughness
Copper
Bonding strength
Alumina
Issue Date: 2013
Source: Lim, J. D., Yeow, S. Y. S., Rhee, M. D., Leong, K. C., & Wong, C. C. (2013). Surface roughness effect on copper–alumina adhesion. Microelectronics Reliability, 53(9-11), 1548-1552.
Series/Report no.: Microelectronics Reliability
Abstract: The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%.
URI: https://hdl.handle.net/10356/81601
http://hdl.handle.net/10220/39596
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2013.07.016
Rights: © 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2013.07.016].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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