Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/81601
Title: | Surface roughness effect on copper–alumina adhesion | Authors: | Lim, Ju Dy Yeow, Su Yi Susan Rhee, MinWoo Daniel Leong, Kam Chew Wong, Chee Cheong |
Keywords: | Surface area Surface roughness Copper Bonding strength Alumina |
Issue Date: | 2013 | Source: | Lim, J. D., Yeow, S. Y. S., Rhee, M. D., Leong, K. C., & Wong, C. C. (2013). Surface roughness effect on copper–alumina adhesion. Microelectronics Reliability, 53(9-11), 1548-1552. | Series/Report no.: | Microelectronics Reliability | Abstract: | The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. | URI: | https://hdl.handle.net/10356/81601 http://hdl.handle.net/10220/39596 |
ISSN: | 0026-2714 | DOI: | 10.1016/j.microrel.2013.07.016 | Rights: | © 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2013.07.016]. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | MSE Journal Articles |
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Surface Roughness Effect on Copper-Alumina Adhesion.pdf | 791.06 kB | Adobe PDF | ![]() View/Open |
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