Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81613
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dc.contributor.authorLiu, Zhaonaen
dc.contributor.authorYadian, Boluoen
dc.contributor.authorLiu, Haien
dc.contributor.authorLiu, Chaoen
dc.contributor.authorZhang, Boweien
dc.contributor.authorRamanujan, R.V.en
dc.contributor.authorHuang, Yizhongen
dc.date.accessioned2016-07-04T09:02:50Zen
dc.date.accessioned2019-12-06T14:34:59Z-
dc.date.available2016-07-04T09:02:50Zen
dc.date.available2019-12-06T14:34:59Z-
dc.date.issued2013en
dc.identifier.citationLiu, Z., Yadian, B., Liu, H., Liu, C., Zhang, B., Ramanujan, R., et al. (2013). Fabrication of hybrid CuO/Pt/Si nanoarray for non-enzymatic glucose sensing. Electrochemistry Communications, 33, 138-141.en
dc.identifier.issn1388-2481en
dc.identifier.urihttps://hdl.handle.net/10356/81613-
dc.description.abstractOrdered mushroom-like hybrid CuO/Pt/Si nanoarrays were fabricated using ion etching followed by the electrochemical method. The process started with patterning the surface of a Si (100) substrate coated with a thin layer of Pt, forming a hybrid array of nanoneedles. Each nanoneedle consists of a Pt nanodot sitting on top of a Si nanorod. Cu nanosphere was subsequently grown on the surface of each Pt dot and then oxidized to CuO by the method of continuous cyclic voltammetry in NaOH solution. Meanwhile, the multiple redox cycles produce a rough and porous surface on these CuO nanospheres, which significantly increases the contact area of the nanosphere surfaces with the external environments. This unique nanostructure array shows excellent electrochemical sensitivity to glucose detection.en
dc.description.sponsorshipASTAR (Agency for Sci., Tech. and Research, S’pore)en
dc.language.isoenen
dc.relation.ispartofseriesElectrochemistry Communicationsen
dc.rights© 2013 Elsevier.en
dc.subjectElectrodepositionen
dc.subjectHybrid nanoarrayen
dc.titleFabrication of hybrid CuO/Pt/Si nanoarray for non-enzymatic glucose sensingen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.identifier.doi10.1016/j.elecom.2013.05.006en
item.fulltextNo Fulltext-
item.grantfulltextnone-
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