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Title: Industrial attachment with Advanced Micro Devices
Authors: Chua, Pauline May Lee.
Keywords: DRNTU::Engineering::Computer science and engineering
Issue Date: 2004
Abstract: The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SAS Student Reports (FYP/IA/PA/PI)

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