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|Title:||Industrial attachment with Advanced Micro Devices||Authors:||Chua, Pauline May Lee.||Keywords:||DRNTU::Engineering::Computer science and engineering||Issue Date:||2004||Abstract:||The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.||URI:||http://hdl.handle.net/10356/8165||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SAS Student Reports (FYP/IA/PA/PI)|
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