Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/81671
Title: | A Monolithically Integrated Pressure/Oxygen/Temperature Sensing SoC for Multimodality Intracranial Neuromonitoring | Authors: | Chan, Wai Pan Narducci, Margarita Gao, Yuan Cheng, Ming-Yuan Cheong, Jia Hao George, Arup K. Cheam, Daw Don Leong, Siew Chong Damalerio, Maria Ramona B. Lim, Ruiqi Tsai, Ming-Ling Rahman, Abdur R. A. Park, Mi Kyoung Kong, Zhi Hui Prashanth, Rao Jai Je, Minkyu |
Keywords: | Capacitance to voltage converter (CVC) capacitive pressure sensor |
Issue Date: | 2014 | Source: | Chan, W. P., Narducci, M., Gao, Y., Cheng, M.-Y., Cheong, J. H., George, A. K., et al. (2014). A Monolithically Integrated Pressure/Oxygen/Temperature Sensing SoC for Multimodality Intracranial Neuromonitoring. IEEE Journal of Solid-State Circuits, 49(11), 2449-2461. | Series/Report no.: | IEEE Journal of Solid-State Circuits | Abstract: | A fully integrated SoC for multimodality intracranial neuromonitoring is presented in this paper. Three sensors including a capacitive MEMS pressure sensor, an electrochemical oxygen sensor and a solid-state temperature sensor are integrated together in a single chip with their respective interface circuits. Chopper stabilization and dynamic element matching techniques are applied in sensor interface circuits to reduce circuit noise and offset. On-chip calibration is implemented for each sensor to compensate process variations. Measured sensitivity of the pressure, oxygen, and temperature sensors are 18.6 aF/mmHg, 194 pA/mmHg, and 2 mV/°C, respectively. Implemented in 0.18 m CMOS, the SoC occupies an area of 1.4 mm × 4 mm and consumes 166 μW DC power. A prototype catheter for intracranial pressure (ICP) monitoring has been implemented and the performance has been verified with ex vivo experiment. | URI: | https://hdl.handle.net/10356/81671 http://hdl.handle.net/10220/40917 |
ISSN: | 0018-9200 | DOI: | 10.1109/JSSC.2014.2345754 | Schools: | School of Electrical and Electronic Engineering | Rights: | © 2014 IEEE. | Fulltext Permission: | none | Fulltext Availability: | No Fulltext |
Appears in Collections: | EEE Journal Articles |
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