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Title: On-chip sub-terahertz surface plasmon polariton transmission lines with mode converter in CMOS
Authors: Liang, Yuan
Yu, Hao
Wen, Jincai
Anak Agung Alit Apriyana
Li, Nan
Luo, Yu
Sun, Lingling
Keywords: impedance
Issue Date: 2016
Source: Liang, Y., Yu, H., Wen, J., Anak Agung Alit Apriyana, Li, N., Luo, Y., et al. (2016). On-chip sub-terahertz surface plasmon polariton transmission lines with mode converter in CMOS. Scientific Reports, 6, 30063-.
Series/Report no.: Scientific Reports
Abstract: An on-chip low-loss and high conversion efficiency plasmonic waveguide converter is demonstrated at sub-THz in CMOS. By introducing a subwavelength periodic corrugated structure onto the transmission line (T-line) implemented by a top-layer metal, surface plasmon polaritons (SPP) are established to propagate signals with strongly localized surface-wave. To match both impedance and momentum of other on-chip components with TEM-wave propagation, a mode converter structure featured by a smooth bridge between the Ground coplanar waveguide (GCPW) with 50 Ω impedance and SPP T-line is proposed. To further reduce area, the converter is ultimately simplified to a gradual increment of groove with smooth gradient. The proposed SPP T-lines with the converter is designed and fabricated in the standard 65 nm CMOS process. Both near-field simulation and measurement results show excellent conversion efficiency from quasi-TEM to SPP modes in a broadband frequency range. The converter achieves wideband impedance matching (<−9 dB) with excellent transmission efficiency (averagely −1.9 dB) from 110 GHz–325 GHz. The demonstrated compact and wideband SPP T-lines with mode converter have shown great potentials to replace existing waveguides as future on-chip THz interconnects. To the best of the author’s knowledge, this is the first time to demonstrate the (sub)-THz surface mode conversion on-chip in CMOS technology.
ISSN: 2045-2322
DOI: 10.1038/srep30063
Schools: School of Electrical and Electronic Engineering 
Rights: This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit
Fulltext Permission: open
Fulltext Availability: With Fulltext
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