Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/84059
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dc.contributor.authorLoeblein, Manuelaen
dc.contributor.authorTsang, Siu Honen
dc.contributor.authorPawlik, Matthieuen
dc.contributor.authorPhua, Eric Jian Rongen
dc.contributor.authorYong, Hanen
dc.contributor.authorZhang, Xiao Wuen
dc.contributor.authorGan, Chee Lipen
dc.contributor.authorTeo, Edwin Hang Tongen
dc.date.accessioned2017-08-07T04:22:28Zen
dc.date.accessioned2019-12-06T15:37:28Z-
dc.date.available2017-08-07T04:22:28Zen
dc.date.available2019-12-06T15:37:28Z-
dc.date.issued2017en
dc.identifier.citationLoeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., et al. (2017). High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. ACS Nano, 11(2), 2033-2044.en
dc.identifier.issn1936-0851en
dc.identifier.urihttps://hdl.handle.net/10356/84059-
dc.description.abstractCompression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C).en
dc.description.sponsorshipMOE (Min. of Education, S’pore)en
dc.format.extent32 p.en
dc.language.isoenen
dc.relation.ispartofseriesACS Nanoen
dc.rights© 2017 American Chemical Society. This is the author created version of a work that has been peer reviewed and accepted for publication by ACS Nano, American Chemical Society. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1021/acsnano.6b08218].en
dc.subjectThree-dimensional h-BNen
dc.subjectThree-dimensional grapheneen
dc.titleHigh-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Materialen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.contributor.researchCNRS International NTU THALES Research Allianceen
dc.contributor.researchTemasek Laboratoriesen
dc.identifier.doi10.1021/acsnano.6b08218en
dc.description.versionAccepted versionen
item.grantfulltextopen-
item.fulltextWith Fulltext-
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