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Title: High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
Authors: Loeblein, Manuela
Tsang, Siu Hon
Pawlik, Matthieu
Phua, Eric Jian Rong
Yong, Han
Zhang, Xiao Wu
Gan, Chee Lip
Teo, Edwin Hang Tong
Keywords: Three-dimensional h-BN
Three-dimensional graphene
Issue Date: 2017
Source: Loeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., et al. (2017). High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. ACS Nano, 11(2), 2033-2044.
Series/Report no.: ACS Nano
Abstract: Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C).
ISSN: 1936-0851
DOI: 10.1021/acsnano.6b08218
Schools: School of Electrical and Electronic Engineering 
School of Materials Science & Engineering 
Research Centres: CNRS International NTU THALES Research Alliance 
Temasek Laboratories 
Rights: © 2017 American Chemical Society. This is the author created version of a work that has been peer reviewed and accepted for publication by ACS Nano, American Chemical Society. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [].
Fulltext Permission: open
Fulltext Availability: With Fulltext
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