Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/84447
Title: Selective Laser Melting Of Copper Based Alloy On Steel: A Preliminary Study
Authors: Tey, Cher Fu
Yeong, Wai Yee
Chen, Songlin
Keywords: Multi-material printing
Selective laser melting
Issue Date: 2016
Source: Tey, C. F., Yeong, W. Y., & Chen, S. (2016). Selective Laser Melting Of Copper Based Alloy On Steel: A Preliminary Study. Proceedings of the 2nd International Conference on Progress in Additive Manufacturing (Pro-AM 2016), 439-444.
Conference: Proceedings of the 2nd International Conference on Progress in Additive Manufacturing (Pro-AM 2016)
Abstract: The constantly increasing requirements of critical engineering parts can often be satisfied through the use of different materials with unique properties. In an effort to realize the potential of multi-functional parts, a study on the melt track characteristics of a copper based alloy (HOVADUR® K220) deposited on 316L steel via Selective Laser Melting (SLM) has been conducted. Single-line melt tracks, processed using 3 different sets of laser parameters, were printed on top of copper based alloy of variable height. It was found that the widths of the line tracks decreased with the height of the copper alloy. When processed at an energy density of 262J/mm3 the width of the copper alloy line tracks decreased from an average of 332μm to 151μm as the layers of underlying copper alloy increased from 0 to 40. Extensive cracking was observed when excessive energy density was used on layers 1 to 6. All scan tracks are continuous with minor amounts of unmelted particles. Track stability is observed to decrease slightly at higher layers as the track width decreases.
URI: https://hdl.handle.net/10356/84447
http://hdl.handle.net/10220/41829
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2016 by Pro-AM 2016 Organizers. Published by Research Publishing, Singapore
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Conference Papers
Pro-AM Conference Papers
SIMTech Conference Papers

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