Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/84727
Title: A jumping shape memory alloy under heat
Authors: Yang, Shuiyuan
Omori, Toshihiro
Wang, Cuiping
Liu, Yong
Nagasako, Makoto
Ruan, Jingjing
Kainuma, Ryosuke
Ishida, Kiyohito
Liu, Xingjun
Keywords: Materials science
Phase transitions and critical phenomena
Issue Date: 2016
Source: Yang, S., Omori, T., Wang, C., Liu, Y., Nagasako, M., Ruan, J., et al. (2016). A jumping shape memory alloy under heat. Scientific Reports, 6, 21754-.
Series/Report no.: Scientific Reports
Abstract: Shape memory alloys are typical temperature-sensitive metallic functional materials due to superelasticity and shape recovery characteristics. The conventional shape memory effect involves the formation and deformation of thermally induced martensite and its reverse transformation. The shape recovery process usually takes place over a temperature range, showing relatively low temperature-sensitivity. Here we report novel Cu-Al-Fe-Mn shape memory alloys. Their stress-strain and shape recovery behaviors are clearly different from the conventional shape memory alloys. In this study, although the Cu-12.2Al-4.3Fe-6.6Mn and Cu-12.9Al-3.8Fe-5.6Mn alloys possess predominantly L21 parent before deformation, the 2H martensite stress-induced from L21 parent could be retained after unloading. Furthermore, their shape recovery response is extremely temperature-sensitive, in which a giant residual strain of about 9% recovers instantly and completely during heating. At the same time, the phenomenon of the jumping of the sample occurs. It is originated from the instantaneous completion of the reverse transformation of the stabilized 2H martensite. This novel Cu-Al-Fe-Mn shape memory alloys have great potentials as new temperature-sensitive functional materials.
URI: https://hdl.handle.net/10356/84727
http://hdl.handle.net/10220/41944
ISSN: 2045-2322
DOI: 10.1038/srep21754
Schools: School of Mechanical and Aerospace Engineering 
Rights: This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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