Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/85047
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dc.contributor.authorXu, G.en
dc.contributor.authorLiu, Y. J.en
dc.contributor.authorFoo, Y. Y.en
dc.contributor.authorChan, R. Y.en
dc.contributor.authorTan, Cher Mingen
dc.contributor.authorChen, Eric Boon Khaien
dc.date.accessioned2010-08-31T03:57:51Zen
dc.date.accessioned2019-12-06T15:56:10Z-
dc.date.available2010-08-31T03:57:51Zen
dc.date.available2019-12-06T15:56:10Z-
dc.date.copyright2008en
dc.date.issued2008en
dc.identifier.citationTan, C. M., Chen, E. B. K., Foo, Y. Y., Chan, R. Y., Xu, G., & Liu, Y. G. (2008). Humidity effect on the degradation of packaged ultra-bright white LEDs. In proceedings of the 10th Electronics Packaging Technology Conference: Singapore (pp.923-928).en
dc.identifier.urihttps://hdl.handle.net/10356/85047-
dc.identifier.urihttp://hdl.handle.net/10220/6379en
dc.description.abstractMany ultra-bright light-emitting diodes (LEDs), especially the white LEDs, are being actively developed for solid-state lighting and many other commercial applications. Hence, it is important to evaluate and understand the failure mechanisms that affect the performance characteristics and lifetimes of these new LEDs. This study concerns the humidity effect on the degradation of GaN-based packaged white LEDs. Under the accelerated humidity test, the LEDs showed a degradation of optical output. With the mixture statistical distribution analysis method, it is noted that the luminous flux degradation of the packaged white LEDs is dependent on more than two failure mechanisms. Two of the failure mechanisms are observed to follow the lognormal distribution. With detailed spectrum analysis and by employing the parameters extraction method, one of the two failure mechanisms that follow the lognormal distribution is observed to be caused by chip related failure due to the accumulated moisture in the encapsulation. For the other failure mechanism, phosphor degradation is noted to be the primary cause.en
dc.format.extent6 p.en
dc.language.isoenen
dc.rights© 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic circuitsen
dc.titleHumidity effect on the degradation of packaged ultra-bright white LEDsen
dc.typeConference Paperen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.contributor.conferenceElectronics Packaging Technology Conference (10th : 2008 : Singapore)en
dc.contributor.organizationA*STAR SIMTechen
dc.contributor.organizationNational Metrology Centreen
dc.identifier.doihttp://dx.doi.org/10.1109/EPTC.2008.4763548en
dc.description.versionPublished versionen
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