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Title: Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
Authors: Ang, X. F.
Chen, Z.
Wong, Chee C.
Wei, J.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2008
Source: Ang, X. F., Chen, Z., Wong, C. C., & Wei, J. (2008). Effect of Chain Length on Low Temperature Gold-Gold Bonding by Self Assembled Monolayers. Applied Physics Letters, 92(13).
Series/Report no.: Applied physics letters
Abstract: The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achieved using octadecanethiol (n=18). These contrasting behaviors can be interpreted as a consequence of two dominant roles of alkanethiols that govern the bonding phenomenon, namely, the passivation of gold surfaces and the ease of mechanical and/or thermal displacement.
DOI: 10.1063/1.2906905
Rights: © 2008 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: 10.1063/1.2906905. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
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