Please use this identifier to cite or link to this item:
|Title:||Slurry flow visualisation of chemical mechanical polishing based on a computational fluid dynamics model||Authors:||Tian, Y. B.
Lai, S. T.
Zhong, Z. W.
|Issue Date:||2012||Source:||Tian, Y. B., Lai, S. T., & Zhong, Z. W. (2012). Slurry Flow Visualisation of Chemical Mechanical Polishing Based on a Computational Fluid Dynamics Model. Advanced Materials Research, 565, 324-329.||Series/Report no.:||Advanced materials research||Abstract:||In this work, we developed a computational fluid dynamics (CFD) model to simulate the slurry flow between the wafers and pad during the chemical mechanical polishing (CMP) process under a multiple-wafer configuration. A serial of simulations were carried out to visualise slurry flow and explore the effects of the process variables concerned on the flow velocity and pressure distributions beneath the wafers. Through the model and simulation, the flow field characteristics were obtained and analyzed under different operating conditions. The results can provide an insight into a fundamental understanding of the slurry flow behaviours under the multiple-wafer configuration and some useful implications for the selection of practical polishing variables.||URI:||https://hdl.handle.net/10356/85373
|ISSN:||1662-8985||DOI:||10.4028/www.scientific.net/AMR.565.324||Rights:||© 2012 Trans Tech Publications, Switzerland.||Fulltext Permission:||none||Fulltext Availability:||No Fulltext|
|Appears in Collections:||MAE Journal Articles|
SIMTech Journal Articles
Updated on Aug 31, 2020
Updated on Nov 24, 2020
Page view(s) 10521
Updated on Dec 1, 2020
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.