Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/86024
Title: Material characterization, thermal analysis, and mechanical performance of a laser-polished Ti alloy prepared by selective laser melting
Authors: Li, Yu-Hang
Wang, Bing
Ma, Cheng-Peng
Fang, Zhi-Hao
Chen, Long-Fei
Guan, Ying-Chun
Yang, Shou-Feng
Keywords: Engineering::Electrical and electronic engineering
Laser Polishing
Additive Manufacturing
Issue Date: 2019
Source: Li, Y.-H., Wang, B., Ma, C.-P., Fang, Z.-H., Chen, L.-F., Guan, Y.-C., & Yang, S.-F. (2019). Material characterization, thermal analysis, and mechanical performance of a laser-polished Ti alloy prepared by selective laser melting. Metals, 9(2), 112-. doi:10.3390/met9020112
Series/Report no.: Metals
Abstract: The laser polishing technique offers an adaptable, accurate, and environmentally friendly solution to enhance the surface quality of additive manufactured metallic components. Recent work has shown that the surface roughness of laser additive manufactured metallic alloys can be significantly reduced via the laser polishing method. This paper examines the mechanical performances of a laser polished surface fabricated by selective laser melting (SLM). Compared with the original SLM surface, systematic measurements revealed that the surface roughness of the laser polished surface can be effectively reduced from 6.53 μm to 0.32 μm, while the microhardness and wear resistance increased by 25% and 39%, respectively. Through a thermal history analysis of the laser polishing process using the finite element model, new martensitic phase formation in the laser polished layer is carefully explained, which reveals significant effects on residual stress, strength, and fatigue. These findings establish foundational data to predict the mechanical performance of laser polished metallic components fabricated by additive manufacturing methods, and pave the way for functional surface design with practical application via the laser process.
URI: https://hdl.handle.net/10356/86024
http://hdl.handle.net/10220/49252
ISSN: 2075-4701
DOI: 10.3390/met9020112
Rights: © 2019 The Author(s). Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/)
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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