Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/86221
Title: Editorial : special issue on “artificial intelligence for future wireless communications and networking”
Authors: Tang, Jianhua
Wang, Jian
Feng, Gang
Quek, Tony Q. S.
Keywords: Engineering::Electrical and electronic engineering
Artificial Intelligence
Wireless Communications
Issue Date: 2019
Source: Quek, T. Q. S., Tang, J., Wang, J., & Feng, G. (2019). Editorial : special issue on “artificial intelligence for future wireless communications and networking”. Digital Communications and Networks, 5(1), 1-2. doi:10.1016/j.dcan.2019.01.002
Series/Report no.: Digital Communications and Networks
Abstract: Recent breakthroughs in Artificial Intelligence (AI) and Machine Learning (ML), including deep neural networks, the availability of huge amount of data, and powerful computing platforms are providing us with technologies to perform tasks that once seemed impossible. The recent win of AlphaGo over the world champion Mr. Lee Sedol has witnessed the power of AI beyond what many of us can imagine. In the near future, autonomous vehicles, intelligent mobile networks, and intelligent internet-of-things will become a norm and AI will be one of the key technologies to make all these possible. Therefore, we forsee that AI can provide many new and unprecedented opportunities in the way we design our wireless and wired data pipelines, the way we manage and optimize our wireless and wired networks, and the way we manage and deliver different user services and user content.
URI: https://hdl.handle.net/10356/86221
http://hdl.handle.net/10220/49274
DOI: 10.1016/j.dcan.2019.01.002
Schools: School of Electrical and Electronic Engineering 
Rights: © 2018 Chongqing University of Posts and Telecommunications. Production and hosting by Elsevier B.V. on behalf of KeAi. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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