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Title: Totally embedded hybrid thin films of carbon nanotubes and silver nanowires as flat homogenous flexible transparent conductors
Authors: Pillai, Suresh Kumar Raman
Wang, Jing
Wang, Yilei
Sk, Md Moniruzzaman
Prakoso, Ari Bimo
Chan-Park, Mary Bee Eng
Keywords: DRNTU::Engineering::Chemical engineering
Carbon Nanotubes
Issue Date: 2016
Source: Pillai, S. K. R., Wang, J., Wang, Y., Sk, M. M., Prakoso, A. B., Rusli, & Chan-Park, M. B. E. (2016). Totally embedded hybrid thin films of carbon nanotubes and silver nanowires as flat homogenous flexible transparent conductors. Scientific Reports, 6, 38453-. doi:10.1038/srep38453
Series/Report no.: Scientific Reports
Abstract: There is a great need for viable alternatives to today’s transparent conductive film using largely indium tin oxide. We report the fabrication of a new type of flexible transparent conductive film using silver nanowires (AgNW) and single-walled carbon nanotube (SWCNT) networks which are fully embedded in a UV curable resin substrate. The hybrid SWCNTs-AgNWs film is relatively flat so that the RMS roughness of the top surface of the film is 3 nm. Addition of SWCNTs networks make the film resistance uniform; without SWCNTs, sheet resistance of the surface composed of just AgNWs in resin varies from 20 Ω/sq to 107 Ω/sq. With addition of SWCNTs embedded in the resin, sheet resistance of the hybrid film is 29 ± 5 Ω/sq and uniform across the 47 mm diameter film discs; further, the optimized film has 85% transparency. Our lamination-transfer UV process doesn’t need solvent for sacrificial substrate removal and leads to good mechanical interlocking of the nano-material networks. Additionally, electrochemical study of the film for supercapacitors application showed an impressive 10 times higher current in cyclic voltammograms compared to the control without SWCNTs. Our fabrication method is simple, cost effective and enables the large-scale fabrication of flat and flexible transparent conductive films.
DOI: 10.1038/srep38453
Rights: © 2016 The Authors (Nature Publishing Group). This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit
Fulltext Permission: open
Fulltext Availability: With Fulltext
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