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Title: Modal analysis of replica boss hole during the deburring process in aerospace manufacturing industry
Authors: Andriani, Claudy
Caesarendra, Wahyu
Tjahjowidodo, Tegoeh
Wijaya, Tomi
Pappachan, Bobby Kaniyamkudy
Keywords: Modal Analysis
DRNTU::Engineering::Mechanical engineering
Aerospace Manufacturing
Issue Date: 2018
Source: Andriani, C., Caesarendra, W., Tjahjowidodo, T., Wijaya, T., & Pappachan, B. K. (2018). Modal analysis of replica boss hole during the deburring process in aerospace manufacturing industry. MATEC Web of Conferences, 159, 02035-. doi:10.1051/matecconf/201815902035
Series/Report no.: MATEC Web of Conferences
Abstract: The monitoring of surface finishing processes in aerospace manufacturing industry becomes one of key issues to maintain the overall quality of product or part. To date, the surface quality monitoring post machining processes such as deburring, use visual inspection, surface roughness test or laser gap gun. The whole manufacturing process then requires a considerable amount of time as the production line must be halted due to these measurements taking place. This study presents an online monitoring system to measure the chamfer quality of replica boss hole post-deburring process. Vibration signal was measured during the deburring process and the features that correlate to the deburring stages (passes) were extracted. This paper focuses on the validation of actual vibration signal with the modal analysis of work coupon (replica boss hole) to obtain the correlation between the vibration amplitude level on particular region and the mode shape of work coupon during the deburring process.
DOI: 10.1051/matecconf/201815902035
Rights: © 2018 The Author(s) (MATEC Web of Conferences) (Published by EDP Sciences). This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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