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https://hdl.handle.net/10356/88255
Title: | Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies | Authors: | Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan |
Keywords: | DRNTU::Engineering::Mechanical engineering::Prototyping Ink Evaporation Soft Substrates |
Issue Date: | 2018 | Source: | Saengchairat, N., Chua, C. K., & Tran, T. (2018). Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 121-126. doi:10.25341/D46K5D | Conference: | Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018) | Abstract: | Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate materials, poor printing resolution, and lack of fundamental understanding on the deposition process of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e., micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation process depends on various contributing parameters such as liquid properties, surface wettability, roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has not been fully understood for soft substrates, which are relevant for fabrication of flexible and stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the electrical properties of the printed patterns can be manipulated. | URI: | https://hdl.handle.net/10356/88255 http://hdl.handle.net/10220/45705 |
DOI: | 10.25341/D46K5D | Schools: | School of Mechanical and Aerospace Engineering | Research Centres: | Singapore Centre for 3D Printing | Rights: | © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | Pro-AM Conference Papers |
Files in This Item:
File | Description | Size | Format | |
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INK EVAPORATION ON SOFT SUBSTRATES FOR ADDITIVE.pdf | 2.56 MB | Adobe PDF | View/Open |
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