Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88315
Title: Capability enhancement in compact digital holographic microscopy
Authors: Qu, Weijuan
Wen, Yongfu
Wang, Zhaomin
Yang, Fang
Asundi, Anand
Keywords: DRNTU::Engineering::Mechanical engineering
Resolution Enhancement
Digital Holographic Microscopy
Issue Date: 2015
Source: Qu, W., Wen, Y., Wang, Z., Yang, F., & Asundi, A. (2015). Capability enhancement in compact digital holographic microscopy. Proceedings of SPIE - International Conference on Experimental Mechanics 2014, 9302, 93020I-. doi:10.1117/12.2081128
Conference: Proceedings of SPIE - International Conference on Experimental Mechanics 2014
Abstract: A compact reflection digital holographic microscopy (DHM) system integrated with the light source and optical interferometer is developed for 3D topographic characterization and real-time dynamic inspection for Microelectromechanical systems (MEMS). Capability enhancement methods in lateral resolution, axial resolving range and large field of view for the compact DHM system are presented. To enhance the lateral resolution, the numerical aperture of a reflection DHM system is analyzed and optimum designed. To enhance the axial resolving range, dual wavelengths are used to extend the measuring range. To enable the large field of view, stitching of the measurement results is developed in the user-friendly software. Results from surfaces structures on silicon wafer, micro-optics on fused silica and dynamic inspection of MEMS structures demonstrate applications of this compact reflection digital holographic microscope for technical inspection in material science.
URI: https://hdl.handle.net/10356/88315
http://hdl.handle.net/10220/46913
DOI: 10.1117/12.2081128
Schools: School of Mechanical and Aerospace Engineering 
Rights: © 2015 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Proceedings of SPIE - International Conference on Experimental Mechanics 2014 and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2081128]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Conference Papers

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