Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88437
Title: Damage monitoring using fiber optic sensors and by analysing electro-mechanical admittance signatures obtained from piezo sensor
Authors: Maheshwari, Muneesh
Annamdas, Venu Gopal Madhav
Pang, John Hock Lye
Tjin, Swee Chuan
Asundi, Anand Krishna
Keywords: Fibre Optic Polarimetric Sensor (FOPS)
Fibre Bragg Grating (FBG)
DRNTU::Engineering::Mechanical engineering
Issue Date: 2015
Source: Maheshwari, M., Annamdas, V. G. M., Pang, J. H. L., Tjin, S. C., & Asundi, A. K. (2015). Damage monitoring using fiber optic sensors and by analysing electro-mechanical admittance signatures obtained from piezo sensor. Proceedings of SPIE - Micro+Nano Materials, Devices, and Systems, 9668, 966816-. doi:10.1117/12.2202547
Abstract: Damage monitoring is the need of the hour in this age of infrastructure. Many methods are being used for damage monitoring in different mechanical and civil structures. Some of them are strain based methods in which abruptly increased strain signifies the presence of damage in the structure. This article focuses on crack monitoring of a fixedfixed beam using fiber optic sensors which can measure strain locally or globally. The two types of fiber optic sensors used in this research are fiber Bragg grating (FBG) and fiber optic polarimetric sensors (FOPS). FBG and FOPS are used for local strain monitoring (at one point only) and global strain monitoring (in the entire specimen) respectively. At the centre of the specimen, a piezoelectric wafer active sensor (PWAS) is also attached. PWAS is used to obtain electromechanical admittance (EMA) signatures. Further, these EMA signatures are analysed to access the damage state in the beam. These multiple smart materials together provide improved information on damages in the specimen which is very valuable for the structural health monitoring (SHM) of the specimen.
URI: https://hdl.handle.net/10356/88437
http://hdl.handle.net/10220/46930
DOI: 10.1117/12.2202547
Rights: © 2015 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Proceedings of SPIE - Micro+Nano Materials, Devices, and Systems and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2202547]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Conference Papers

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