Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/88501
Title: Wideband sound absorption of 3D printed multi-layer micro-perforated panels
Authors: Yang, Wenjing
Yuan, Shangqin
Zhou, Kun
Chua, Chee Kai
Keywords: 3D Printing
Additive Manufacturing
DRNTU::Engineering::Mechanical engineering::Prototyping
Issue Date: 2018
Source: Yang, W., Yuan, S., Chua, C. K., & Zhou, K. (2018). Wideband sound absorption of 3D printed multi-layer micro-perforated panels. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 370-375. doi:10.25341/D4C307
Conference: Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018)
Abstract: Micro-perforated panel (MPP) absorbers have been applied widely in noise reduction and sound damping. In order to obtain wideband sound absorption, novel structures of MPPs with various numbers of panel layers and spacing distances between them were designed. The structures were manufactured by selective laser sintering, which is an advanced 3D printing technique producing complex structures effectively. The sound absorption coefficients of MPPs were measured by the impedance tube method. The results suggested that the multi-layer structures significantly increased the bandwidths of the absorption compared to the single-layer MPPs. This research work demonstrates the large potential of artificial acoustic designs of MPP via 3D printing for wideband absorption through controlling the layer number and the spacing distance.
URI: https://hdl.handle.net/10356/88501
http://hdl.handle.net/10220/45851
DOI: 10.25341/D4C307
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:Pro-AM Conference Papers

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