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|Title:||Silicon wafer microstructure imaging using InfraRed Transport of Intensity Equation||Authors:||Li, Hongru
|Issue Date:||2015||Source:||Li, H., Feng, G., Bourgade, T., Zuo, C., Du, Y., Zhou, S., & Asundi, A. (2015). Silicon wafer microstructure imaging using InfraRed Transport of Intensity Equation. Proceedings of SPIE - International Conference on Experimental Mechanics 2014, 9302, 93023I-. doi:10.1117/12.2078579||Abstract:||A novel quantitative 3D imaging system of silicon microstructures using InfraRed Transport of Intensity Equation (IRTIE) is proposed in this paper. By recording the intensity at multiple planes and using FFT or DCT based TIE solver, fast and accurate phase retrieval for both uniform and non-uniform intensity distributions is proposed. Numerical simulation and experiments confirm the accuracy and reliability of the proposed method. The application of IR-TIE for inspection of micro-patterns in visibly opaque media using 1310 nm light source is demonstrated. For comparison, micro-patterns are also inspected by the contact scanning mode Taylor Hobson system. Quantitative agreement suggests the possibility of using IR-TIE for phase imaging of silicon wafers.||URI:||https://hdl.handle.net/10356/89429
|DOI:||10.1117/12.2078579||Rights:||© 2015 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Proceedings of SPIE - International Conference on Experimental Mechanics 2014 and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2078579]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Conference Papers|
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