Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/90031
Title: A brief review of the shape memory phenomena in polymers and their typical sensor applications
Authors: Sun, Li
Wang, Tao Xi
Chen, Hong Mei
Salvekar, Abhijit Vijay
Naveen, Balasundaram Selvan
Xu, Qinwei
Weng, Yiwei
Guo, Xinli
Chen, Yahui
Huang, Wei Min
Keywords: Shape Memory Polymer
Engineering::Mechanical engineering
Shape Memory Material
Issue Date: 2019
Source: Sun, L., Wang, T. X., Chen, H. M., Salvekar, A. V., Naveen, B. S., Xu, Q., . . . Huang, W. M. (2019). A Brief Review of the Shape Memory Phenomena in Polymers and Their Typical Sensor Applications. Polymers, 11(6), 1049-. doi:10.3390/polym11061049
Series/Report no.: Polymers
Abstract: In this brief review, an introduction of the underlying mechanisms for the shape memory effect (SME) and various shape memory phenomena in polymers is presented first. After that, a summary of typical applications in sensors based on either heating or wetting activated shape recovery using largely commercial engineering polymers, which are programmed by means of in-plane pre-deformation (load applied in the length/width direction) or out-of-plane pre-deformation (load applied in the thickness direction), is presented. As demonstrated by a number of examples, many low-cost engineering polymers are well suited to, for instance, anti-counterfeit and over-heating/wetting monitoring applications via visual sensation and/or tactual sensation, and many existing technologies and products (e.g., holography, 3D printing, nano-imprinting, electro-spinning, lenticular lens, Fresnel lens, QR/bar code, Moiré pattern, FRID, structural coloring, etc.) can be integrated with the shape memory feature.
URI: https://hdl.handle.net/10356/90031
http://hdl.handle.net/10220/49361
DOI: 10.3390/polym11061049
Schools: School of Mechanical and Aerospace Engineering 
Rights: © 2019 by the Authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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