Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/90406
Title: Bimetallic silver-gold film waveguide surface plasmon resonance sensor
Authors: Ong, Biow Hiem
Yuan, Xiaocong
Tjin, Swee Chuan
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics
Issue Date: 2007
Source: Ong, B. H., Yuan, X., & Tjin, S. C. (2007). Bimetallic silver-gold film waveguide surface plasmon resonance sensor. Fiber and Integrated Optics, 26(4), 229-240.
Series/Report no.: Fiber and integrated optics
Abstract: It is desirable that a surface plasmon resonance (SPR) sensor is highly sensitive to binding interactions within the sensing region, generate evanescent fields with long penetration depths, and utilize a metal film that is very stable even in extreme environmental conditions. In this study, we present the first example of a wavelength-modulated waveguide SPR sensor with a bimetallic silver-gold film for surface plasmon excitation. The underlying silver yields better evanescent field enhancement of the sensing surface, while the overlying gold ensures that the stability of the metallic film is not compromised. It is shown experimentally that in terms of dλ/dn, the bimetallic film waveguide SPR configuration has a sensitivity of 1232 nm/RIU, greater than two times improvement from the 594 nm/RIU achievable with single gold film waveguide SPR sensor. The higher sensitivity, compact nature, and better evanescent field enhancement of this configuration provides the potential to biosensing applications.
URI: https://hdl.handle.net/10356/90406
http://hdl.handle.net/10220/4368
ISSN: 0146-8030
1096-4681
DOI: 10.1080/01468030701347106
Rights: © 2007 Taylor & Francis This is the author created version of a work that has been peer reviewed and accepted for publication by Fiber and Integrated Optics, Taylor & Francis. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [DOI: http://dx.doi.org/10.1080/01468030701347106].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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