Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/91301
Title: A CMOS ISFET interface circuit with dynamic current temperature compensation technique
Authors: Chan, Pak Kwong
Chen, D. Y.
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2007
Source: Chan, P. K. & Chen, D. Y. (2007). A CMOS ISFET interface circuit with dynamic current temperature compensation technique. IEEE Transactions on Circuits and Systems - I: Regular Papers, 54(1), 119-129.
Series/Report no.: IEEE transactions on circuits and systems - I : regular papers
Abstract: This paper presents a new ion-sensitive field-effect transistor (ISFET ) readout circuit including a novel nonlinear temperature compensation method that is based on the theoretical work for formulating a body-effect-based ISFET drain current expression, the derivation of an unified temperature-dependent ISFET threshold voltage expression, and the use of iterative method for solving design parameters in nonlinear equations. Regarding the basic readout circuit, it comprises only one source follower and one current source to establish a self-biased configuration for a single ISFET device. Due to elimination of body effect, it displays linear transfer characteristic in the experimental result. Incorporating temperature compensation further improves the thermal stability of the ISFET device in pH sensing function. This has been validated by the experimental results on pH values ranging from 4 to 9 in a temperature range of 22 C to 50 C from the measurement setup. The pH7 parameter is used as a reference in the method. The proposed works are attractive in terms of circuit simplicity, temperature-compensated performance, cost and compatibility for smart sensor operation.
URI: https://hdl.handle.net/10356/91301
http://hdl.handle.net/10220/4660
ISSN: 1057-7122
DOI: 10.1109/TCSI.2006.887977
Schools: School of Electrical and Electronic Engineering 
Rights: © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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