Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/91522
Title: Propagation mechanisms of radio waves over intra-chip channels with integrated antennas : frequency-domain measurements and time-domain analysis
Authors: Zhang, Yue Ping
Chen, Zhiming
Sun, Mei
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2007
Source: Zhang, Y. P., Chen, Z. M., & Sun, M. (2007). Propagation mechanisms of radio waves over intra-chip channels with integrated antennas: Frequency-domain measurements and time-domain analysis. IEEE Transactions on Antennas and Propagation, 55(10), 2900-2906.
Series/Report no.: IEEE transactions on antennas and propagation
Abstract: The propagation mechanisms of radio waves over intra-chip channels was studied with integrated antennas for wireless chip area networks. Test vehicles were designed and fabricated on silicon wafers of both low and high resistivities, respectively, using complementary metal oxide semiconductor (CMOS) processes. On-wafer measurements for propagation of radio waves over intra-chip channels were conducted in the frequency domain from 10 to 110 GHz with a network analyzer. Time-domain analysis was performed to characterize intra-chip radio channels and more importantly to understand the propagation mechanisms. It was found that path loss factor is constantly less than two and propagation delay of the first-arrival wave is significantly longer than that by free-space transmission. Thus, we concluded that the propagation of radio waves over intra-chip channels is mainly realized with surface wave rather than space wave. Surface wave is guided on air-wafer interface. In addition, effects of metal lines, in both parallel and normal placements with respect to wave propagation direction, on signal propagation were also investigated.
URI: https://hdl.handle.net/10356/91522
http://hdl.handle.net/10220/5998
ISSN: 0018-926X
DOI: 10.1109/TAP.2007.905867
Rights: IEEE Transactions on Antennas and Propagation © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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